Javid M.
Senior Principal Mechanical Engineer
Experience
Mar 2023 - Present
2 years 9 monthsEl Segundo, United States
Senior Principal Mechanical Engineer
Cesium Astro
- Was responsible for electronic packaging and mechanical design of Ka-Band, S-Band and L-Band Active Electronically Scanned Phase Array Transmitters, Receivers and Antennas for space, military and commercial aircraft. Developed concepts into 3D models and mechanical drawings to capture design details.
- Designed conductive and ambient cooled chassis, and VPX, RF, power supply, and I/O plug-in modules and back planes.
- Performed thermal and structural analysis, using ANSYS Workbench.
- Led continuous improvement in product designs and mechanical engineering practices, identifying and implementing improvements.
- Served as mechanical lead for cross-functional product development teams, meeting customer deliverable requirements.
- Supported new business development through evaluating proposed mechanical requirements, generating compliance matrices, and preparing technical responses to RFPs.
- Conducted root cause analysis investigations for product mechanical issues, recommending, implementing, and documenting corrective actions.
- Documented product design and manufacturing process changes through Engineering Change Orders.
- Incorporated design for manufacturing principles into product designs.
- Led environmental test planning, execution, and documentation efforts against environmental requirements such as RTCA/DO-160G, MIL-STD-810G and NASA specifications.
- Collaborated with parent company’s mechanical engineering team in Austin, TX to implement common engineering processes and best practices.
Aug 2021 - Mar 2023
1 year 8 monthsTorrance, United States
Senior Principal Mechanical, Electronic Packaging Engineer
Epirus Inc.
- Designed mechanical and RF electronic assemblies for direct energy counter-electronics systems and phase array radars, utilizing solid-state Gallium Nitride and high-power L-band microwave (HPM) technology.
- Designed air and liquid cooled Line Replaceable Modules (LRMs) with RF output power of 8 kilowatts housing two high power RF amplifiers, a dual-active-bridge assembly, a power control assembly and a point of load assembly.
- Designed various types of antennas for counter-electronics systems and phase array radars.
- Designed a trailer mounted 12×12 array structure housing 144 LRMs, main power supplies, military grade Ethernet switches and FR to digital electronics, sealed against liquid and RF intrusion.
- Designed and developed 3D models, detail drawings and BOMs for electronic assemblies and cables using SolidWorks and NX; managed documentation in the PDM system.
- Performed weight optimization of mechanical parts using modal analysis and detailed stack up analysis with GD&T.
- Assembled and tested prototypes for proof of concept.
- Ensured design meets EMI and MIL-STD-810 environmental requirements.
- Selected materials, hardware, connectors, back shells, O-rings, wires and other mechanical components.
- Active member of Material Review Board with experience in discrepant hardware process.
- Deep understanding of manufacturing processes such as machining, sheet metal fabrication, soldering and casting.
- Performed thermal, CFD and structural analysis using ANSYS Workbench, SolidWorks Simulation Premium and IcePack.
- Performed environmental qualification testing of assemblies and cabling systems.
- Wrote mechanical and environmental qualification test procedures and designed required test fixtures.
- Wrote mechanical and environmental sections of proposals and prepared cost estimates.
Jul 2018 - Aug 2021
3 years 2 monthsLos Angeles, United States
Senior Principal Mechanical, Electronic Packaging Engineer
Northrop Grumman
- Performed conceptual design for next generation inertial navigation systems and gyroscopes, applying advanced technical principles and contributing to the development of new concepts.
- Designed and modeled complex 3D geometries using Creo and SolidWorks.
- Designed parts and assemblies for high temperature, space, radiation, high shock and vibration environments.
- Experienced in fabrication processes for full product lifecycle from prototyping to full rate production.
- Performed preliminary structural and thermal analysis using ANSYS Workbench and SolidWorks Simulation Premium.
- Communicated effectively with internal and external customers.
Jun 2015 - Apr 2018
2 years 11 monthsPasadena, United States
Senior Mechanical Engineer
Rockley Photonics
- Developed mechanical reference designs for OPA (Optical Phase Array) based 3D LiDAR products for autonomous vehicles.
- Designed packages for silicon photonics based Optical Phase Array chips for automotive applications.
- Completed optomechanical design of 100G and 400G V-grooved silicon photonics based QSFP transceivers with integrated laser and driver chips.
- Developed packages for optical packet switching devices and optical transceivers for data center networks, housing silicon photonics parts and CMOS in a polarization-independent waveguide platform for high-density WDM routing.
- Selected materials, performed thermal and structural analysis; worked with offshore vendors to develop manufacturing and assembly processes; created 3D models and fabrication drawings using SolidWorks; performed thermal, CFD and structural analysis using ANSYS Workbench and IcePack.
- Designed LGA sockets and loading mechanisms to ensure ease of assembly and reliable performance.
- Developed reference designs for 1U rack mounted switches following Open Compute guidelines, designing sheet metal chassis, connector panels, fan casings, fiber optic splice trays and heat sinks; selected cooling fans and connectors; performed thermal and structural analysis; tracked design to cost and presented results at product review meetings.
Jan 2013 - Jun 2015
2 years 6 monthsBurbank, United States
Electronic Packaging Engineer
Crane Aerospace & Electronics
- Designed ARINC 600 electronic enclosures, castings, printed wiring boards and circuit card assemblies for 737, C919, E2 and F35 Brake Control Systems using SolidWorks and Altium.
- Prepared and released drawings and artwork; assisted manufacturing to resolve process and soldering issues.
- Wrote work instructions and product specifications; reviewed environmental qualification test procedures; interfaced with suppliers and assembly houses; aided procurement and quality to identify and qualify suppliers.
- Member of MRB team.
- Performed thermal analysis, CFD and structural analysis using SolidWorks Simulation and ANSYS.
Dec 2006 - Nov 2012
6 yearsTorrance, United States
Electronic Packaging Engineer
Moog, Inc.
- Senior electronic packaging engineer for design of high voltage power drives for Electro Hydrostatic Actuators and flight control systems.
- Designed and developed 3D models, detail drawings and BOMs for wing mounted hermetically sealed power electronic units and cabling for military fighters, Boeing 787 and Airbus A350 using SolidWorks, NX and ANSYS Workbench.
- Designed the NASA Ares I Upper Stage Instrument Unit Avionics subjected to high shock levels.
- Designed and developed six-pack IGBT motor drive and active front end modules for harsh environments.
- Performed thermal, CFD and structural analysis using ANSYS.
- Designed ARINC 600 style enclosures and circuit cards for Boeing 747-8 lateral control electronics, Gulfstream G250, G450 and G650 flight control electronics.
- Designed packaging of actuator mounted remote electronic units for Airbus A350 primary hydraulic actuators.
- Performed environmental qualification testing of electronic units and cabling systems.
- Wrote mechanical environmental qualification test procedures and designed required test fixtures.
- Created and maintained Preferred Parts List, Engineering Standards and detail Design Checklists for the electronic packaging group.
Jan 1992 - Dec 2006
15 yearsLos Angeles, United States
Senior Principal Hardware Design Engineer
BAE Systems Platform Solutions
- Mechanical design and electronic packaging engineer for commercial and military control systems.
- Designed mechanical and electronic assemblies for navigation and flight control systems using SolidWorks and Unigraphics.
- Designed ambient cooled or forced air-cooled, machined, dip-brazed enclosures for high reliability electronics.
- Performed research, trade studies, technology selection and material characterization for fly-by-light fiber optic flight control systems.
- Wrote environmental test procedures and performed temperature, altitude, vibration, acoustic noise, salt fog and humidity tests.
- Active member of variability reduction programs, design review board and design to cost board.
- Worked with customers and vendors to ensure compliance to specifications; aided manufacturing in setting up assembly lines, selecting equipment and optimizing processes.
- Performed structural and thermal analysis using ANSYS Workbench and Cosmos.
Summary
- Hands on mechanical design engineer of structures, electronic assemblies, rotating assemblies, motor drives, power supplies, RF boards and assemblies, harsh space environment chassis, machined parts and cabling for commercial, military and space applications.
- Strong record of designing products across multiple categories that produce highly reliable products with a first pass outcome.
- Proven ability in developing products and processes from concept through finished product, with close attention to budget, schedule, quality and product requirements.
- Well-honed abilities to negotiate and communicate with diverse internal and external customers and cross-functional teams consisting of members from multiple entities such as subcontractors, manufacturing, quality, purchasing, and suppliers.
- Provided on going career and technical guidance to entry and mid-level engineers in order to foster their growth and understanding of product design, electronic packaging and interconnection technologies.
Languages
English
NativeEducation
Rensselaer Polytechnic Institute
Master of Business Administration · Business Administration · Troy, United States
Rensselaer Polytechnic Institute
Bachelor of Science · Mechanical Engineering · Troy, United States
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