Michael (Dipl.-ing.) Schulze

Senior Hardware Development

Michael Schulze
Schwerin, Germany

Experience

Jun 2024 - Nov 2024
6 months
Schwerin, Germany

Senior Hardware Development

Sabik Offshore GmbH

HD-PLC Gateway project

Responsibilities included use case analysis, evaluation tests, device specification, component research, cost price calculation, project planning, system design, circuit development + simulation, PCB layout, reliability analysis, engineering/EMC tests

Key areas: Mixed-signal design (multiprocessor), DC/DC design, manufacturing-oriented design, lightning protection

Technologies: Altium Designer, LTSpice, PSpice for TI, MS Office

Jan 2022 - Apr 2024
1 year 4 months
Schorndorf, Germany

Lead Engineer

Swoboda Schorndorf KG

Lead engineering for automotive sensors

Responsibilities included specification assessment, requirements and feasibility analysis, variant comparison, system design, component research, technical coordination with customers and suppliers

Focus on design of inductive and magnetic sensor systems (rotor position, pedal position, speed) and inertia measurement units for automotive, tolerance analysis, cost optimization, functional safety (ASIL)

Technologies: Altium Designer, LTSpice, Polarion, MS Office

Jun 2022 - Oct 2022
5 months
Denkendorf, Germany

Hardware Engineer

CGS Prozessanalytik GmbH

Control and display board with Profibus/Profinet interface

Responsibilities included specification coordination, component research, system design, circuit development, PCB layout, manufacturing data

Key areas: Mixed-signal design (NXP ARM Cortex M0+ MCU), analog/digital industrial process I/O, high resolution analog frontend, DC/DC SMPS, 3D modeling

Technologies: Altium Designer, LTSpice

Jan 2021 - May 2022
5 months
Langenselbold, Germany

Hardware Engineer

SYSCO Sicherheitssysteme GmbH

Combined monitoring sensor (position, dynamic tilt, structure-borne sound, temperature)

Responsibilities included specification, component research, variant comparison, system design, circuit development, PCB layout

Key areas: Mixed-signal (NXP ARM Cortex M4), wide range DC/DC SMPS, lightning protection, 3D modeling

Technologies: Altium Designer, LTSpice

Sep 2021 - Jun 2024
2 years 10 months
Schwerin, Germany

Senior Hardware Development

Sabik Offshore GmbH

Product maintenance of lighting systems for offshore wind farms

Responsibilities included component research, system design, circuit development, PCB layout, reliability analysis, engineering/EMC tests, general technical support, employee training, technical end-customer support, technical coordination with EMS and other external service providers, conformity assessments

Key areas: Mixed-signal design (MICROCHIP PIC32, STM32), manufacturing-oriented design, solving procurement problems, lightning protection, reliability calculation

Technologies: Siemens PADS, Altium Designer, LTSpice, GreenPAK Designer (Mixed Signal Programmable Logic)

Jun 2020 - Aug 2021
1 year 3 months
Schwerin, Germany

Head of Technology

premiso AG

iIoT based condition monitoring for process industry

Responsibilities included product development management, product management, requirements analysis, specifications, system design, software specification, development of evaluation algorithms, circuit development and simulation, engineering tests, proof of concept tests, technical end-customer support

Key areas: Ultrasonic wall thickness measurement, GRP structure analysis with ultrasound, ATEX, battery management, LoRa WAN, mixed signal design (NXP Cortex M4, STM32), low power design, piezo transducer frontend

Technologies: Siemens PADS, LTSpice, Scilab

Mar 2011 - May 2020
9 years 3 months
Schwerin, Germany

R&D Manager

Sabik Offshore GmbH

Networked lighting systems for offshore wind farms (visual, acoustic, radio), nautical signals

Responsibilities included product development management, product management, system design, software specification, circuit development, PCB layout, engineering/EMC tests, product certifications (CE, UL/CSA, FVT, BSH), reliability and lifetime analysis, technical coordination with EMS and other external service providers

Key areas: Mixed-signal design (MICROCHIP PIC32, NXP ARM Cortex M4, NORDIC nRF), multiprocessor systems, fieldbus protocol design (NAi), SMPS design (DC/DC converter, LED driver, battery charger), battery management (UPS), low power design, high reliability design, digital audio/Class-D amplifier, power line communication, GNSS, GSM, AIS, GlobalStar, lightning protection, solar charger, methanol fuel cell

Technologies: Mentor PADS, LTSpice, GreenPAK Designer (Mixed Signal Programmable Logic), FMEA, HALT

Jul 1997 - Feb 2011
13 years 8 months
Schwerin, Germany

Co-founder and Head of Development

ds automation gmbh

Projects included acoustic sensors for industrial applications, system for automatic recognition of video sequences, steering movement sensor for commercial vehicles

Responsibilities included product development management, product definition, product management, system design, software specification, circuit development, PCB layout, engineering tests, software development

Key areas: Mixed-signal design (MICROCHIP PIC8/16/24, dsPIC32, Renesas, Atmel), GMR sensor frontend, automotive, ATEX, digital signal processing (TI TMS320C6x, NXP TriMedia, Win32), analog/digital audio frontends, video compression (MJPEG), pattern recognition

Technologies: Mentor INTEGRA, TI Code Composer (ANSI C, Assembler), Microsoft Visual Studio (ANSI C), Agilent VEE

Apr 1990 - Mar 1997
7 years
Schwerin, Germany

Co-founder and Managing Director/Head of Development

Cenith Control GmbH

Projects included eddy current based crack testing, eddy current based contactless length and speed measurement

Responsibilities included product development management, product definition, product management, system design, circuit development, software development, engineering tests

Key areas: Analog/digital signal processing (Lucent DSP32C), eddy current probe frontend, filtering/demodulation (analog/digital), cross correlation analysis, RTOS

Technologies: DSP32C Assembler, Turbo Pascal

Summary

- Mixed Signal Design with 8/16/32-bit Controllers/Signal Processors - ATEX, Automotive, Marine and Industrial Electronic Design - High Performance Analog Circuit Design (Audio, Sensor Frontends) - SMPS / High Power LED Controller / Battery Management System Design - EMV and Production-Compliant PCB Design - Reliability and Lifetime Analysis of Electronic Assemblies and Systems - Coordinated Lightning Protection in Distributed Electronic Systems

Languages

German
Native

Education

Oct 1983 - Jun 1988

Wilhelm-Pieck-Universität Rostock

Technische Kybernetik und Automatisierungstechnik · Rostock, Germany

Certifications & licenses

IT Liability Insurance Exali EX.MPI.48796

Exali