Use case analysis, evaluation tests, hard- and software specification, component research, cost price calculation, project planning and controlling, system design, circuit development and simulation, PCB layout, reliability analysis, engineering/EMC tests.
Key areas included mixed-signal design (multiprocessor), DC/DC design, production-ready design, and lightning protection.
Technologies: Altium Designer, LTSpice, MS Office, MS Project.
Evaluation of specifications, requirement and feasibility analysis, variant comparison, system design, component research, and technical coordination with customers and suppliers.
Specialized in designing inductive and magnetic sensor systems (rotor position, pedal position, speed) and inertia measurement units for automotive applications, tolerance analysis, cost optimization, and functional safety (ASIL).
Technologies: Altium Designer, LTSpice, Polarion, MS Office.
Coordination of requirement specifications, component research, system design, circuit development, PCB layout, and production data preparation.
Focused on mixed-signal design (NXP ARM Cortex M0+ MCU), analog/digital industrial process I/O, high-resolution analog frontend, DC/DC SMPS, and 3D modeling.
Technologies: Altium Designer, LTSpice.
Managed requirement specifications, component research, variant comparison, system design, circuit development, and PCB layout.
Specialized in mixed-signal engineering (NXP ARM Cortex M4), wide range DC/DC SMPS, lightning protection, and 3D modeling.
Technologies: Altium Designer, LTSpice.
Responsible for component research, system design, circuit development, PCB layout, reliability analyses, engineering/EMC tests, general technical support, employee training, technical end-customer support, technical coordination with EMS and other external service providers, and conformity evaluations.
Focused on mixed-signal design (MICROCHIP PIC32, STM32), production-ready design, solving procurement issues, lightning protection, reliability calculation.
Technologies: Siemens PADS, Altium Designer, LTSpice, GreenPAK Designer (Mixed Signal Programmable Logic).
Led product development and management, requirement analyses, specifications, system design, software specs, development of evaluation algorithms, circuit development and simulation, engineering tests, proof-of-concept tests, and technical end-customer support.
Areas of expertise included ultrasound wall thickness measurement, GFK structural analysis with ultrasound, ATEX standards, battery management, LoRa WAN, mixed signal design (NXP Cortex M4, STM32), low power design, piezo transducer frontend.
Technologies: Siemens PADS, LTSpice, Scilab.
Directed product development, management, system design, software specifications, circuit development, PCB layout, engineering/EMC tests, product certifications (CE, UL/CSA, FVT, BSH), reliability, and lifetime analyses, and technical coordination with EMS and external service providers.
Specialized in mixed-signal design (MICROCHIP PIC32, NXP ARM Cortex M4, NORDIC nRF), multi-processor systems, fieldbus protocol design (NAi), DC/DC converter systems, battery management (UPS), high reliability design, digital audio/class-D amplifier, power line communication, GNSS, GSM, AIS, GlobalStar, lightning protection, solar charging and methanol fuel cells.
Technologies: Mentor PADS, LTSpice, GreenPAK Designer (Mixed Signal Programmable Logic), FMEA, HALT.
Led product development, definition, management, system design, software specification, circuit development, PCB layout, engineering tests, and software development.
Key areas included mixed-signal design (MICROCHIP PIC8/16/24, dsPIC32, Renesas, Atmel), GMR sensor frontend, automotive standards, ATEX implementations, digital signal processing (TI TMS320C6x, NXP TriMedia, Win32), analog/digital audio frontends, video compression (MJPEG), and pattern recognition.
Technologies: Mentor INTEGRA, TI Code Composer (ANSI C, Assembler), Microsoft Visual Studio (ANSI C), Agilent VEE.
Directed product development, definition, management, system design, circuit development, software development, and engineering tests.
Specialized in analog/digital signal processing (Lucent DSP32C), eddy current probe frontend, filtering/demodulation (analog/digital), cross-correlation analysis, and RTOS.
Technologies: DSP32C Assembler, Turbo Pascal.
Studied in the field of technical cybernetics and automation engineering with a specialization in energy electronics.
Diploma thesis: "Adaptive speed control of an inverter-fed asynchronous machine."
Mixed Signal Hardware Design mit 8/16/32-bit-Controllern/ Signalprozessoren
ATEX, Automotive, Marine and Industrial Electronic Design
High Performance Analog Circuit Design (Audio, Sensor Frontends)
SMPS / High Power LED Controller / Battery Management System Design
EMV- und fertigungsgerechtes PCB-Design
Zuverlässigkeits- und Lebensdaueranalyse von elektronischen Baugruppen und Systemen
Koordinierter Blitzschutz in verteilten elektronischen Systemen
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