HD-PLC Gateway project
Responsibilities included use case analysis, evaluation tests, device specification, component research, cost price calculation, project planning, system design, circuit development + simulation, PCB layout, reliability analysis, engineering/EMC tests
Key areas: Mixed-signal design (multiprocessor), DC/DC design, manufacturing-oriented design, lightning protection
Technologies: Altium Designer, LTSpice, PSpice for TI, MS Office
Lead engineering for automotive sensors
Responsibilities included specification assessment, requirements and feasibility analysis, variant comparison, system design, component research, technical coordination with customers and suppliers
Focus on design of inductive and magnetic sensor systems (rotor position, pedal position, speed) and inertia measurement units for automotive, tolerance analysis, cost optimization, functional safety (ASIL)
Technologies: Altium Designer, LTSpice, Polarion, MS Office
Control and display board with Profibus/Profinet interface
Responsibilities included specification coordination, component research, system design, circuit development, PCB layout, manufacturing data
Key areas: Mixed-signal design (NXP ARM Cortex M0+ MCU), analog/digital industrial process I/O, high resolution analog frontend, DC/DC SMPS, 3D modeling
Technologies: Altium Designer, LTSpice
Combined monitoring sensor (position, dynamic tilt, structure-borne sound, temperature)
Responsibilities included specification, component research, variant comparison, system design, circuit development, PCB layout
Key areas: Mixed-signal (NXP ARM Cortex M4), wide range DC/DC SMPS, lightning protection, 3D modeling
Technologies: Altium Designer, LTSpice
Product maintenance of lighting systems for offshore wind farms
Responsibilities included component research, system design, circuit development, PCB layout, reliability analysis, engineering/EMC tests, general technical support, employee training, technical end-customer support, technical coordination with EMS and other external service providers, conformity assessments
Key areas: Mixed-signal design (MICROCHIP PIC32, STM32), manufacturing-oriented design, solving procurement problems, lightning protection, reliability calculation
Technologies: Siemens PADS, Altium Designer, LTSpice, GreenPAK Designer (Mixed Signal Programmable Logic)
iIoT based condition monitoring for process industry
Responsibilities included product development management, product management, requirements analysis, specifications, system design, software specification, development of evaluation algorithms, circuit development and simulation, engineering tests, proof of concept tests, technical end-customer support
Key areas: Ultrasonic wall thickness measurement, GRP structure analysis with ultrasound, ATEX, battery management, LoRa WAN, mixed signal design (NXP Cortex M4, STM32), low power design, piezo transducer frontend
Technologies: Siemens PADS, LTSpice, Scilab
Networked lighting systems for offshore wind farms (visual, acoustic, radio), nautical signals
Responsibilities included product development management, product management, system design, software specification, circuit development, PCB layout, engineering/EMC tests, product certifications (CE, UL/CSA, FVT, BSH), reliability and lifetime analysis, technical coordination with EMS and other external service providers
Key areas: Mixed-signal design (MICROCHIP PIC32, NXP ARM Cortex M4, NORDIC nRF), multiprocessor systems, fieldbus protocol design (NAi), SMPS design (DC/DC converter, LED driver, battery charger), battery management (UPS), low power design, high reliability design, digital audio/Class-D amplifier, power line communication, GNSS, GSM, AIS, GlobalStar, lightning protection, solar charger, methanol fuel cell
Technologies: Mentor PADS, LTSpice, GreenPAK Designer (Mixed Signal Programmable Logic), FMEA, HALT
Projects included acoustic sensors for industrial applications, system for automatic recognition of video sequences, steering movement sensor for commercial vehicles
Responsibilities included product development management, product definition, product management, system design, software specification, circuit development, PCB layout, engineering tests, software development
Key areas: Mixed-signal design (MICROCHIP PIC8/16/24, dsPIC32, Renesas, Atmel), GMR sensor frontend, automotive, ATEX, digital signal processing (TI TMS320C6x, NXP TriMedia, Win32), analog/digital audio frontends, video compression (MJPEG), pattern recognition
Technologies: Mentor INTEGRA, TI Code Composer (ANSI C, Assembler), Microsoft Visual Studio (ANSI C), Agilent VEE
Projects included eddy current based crack testing, eddy current based contactless length and speed measurement
Responsibilities included product development management, product definition, product management, system design, circuit development, software development, engineering tests
Key areas: Analog/digital signal processing (Lucent DSP32C), eddy current probe frontend, filtering/demodulation (analog/digital), cross correlation analysis, RTOS
Technologies: DSP32C Assembler, Turbo Pascal